cystech electronics corp. spec. no. : c809j3 issued date : 2008.06.12 revised date: 2010.12.08 page:1/7 BTB772J3 cystek product specification low vcesat pnp epitaxial planar transistor BTB772J3 features ? low v ce (sat) ? excellent current gain characteristics ? complementary to btd882j3 ? rohs compliant package symbol outline absolute maximum ratings (ta=25 c) parameter symbol limit unit collector-base voltage v cbo -40 v collector-emitter voltage v ceo -30 v emitter-base voltage v ebo -6 v i c (dc) -3 a collector current i c (pulse) -5 *1 a pd(ta=25 ) 1.25 power dissipation pd(tc=25 ) 10 w junction temperature tj 150 c storage temperature tstg -55~+150 c note : *1. single pulse pw 350 Q s,duty 2% Q . BTB772J3 to-252ab to-252aa b base c collector e emitter b c e b c e bv ceo -30v i c -3a r ce(sat) 225m typ.
cystech electronics corp. spec. no. : c809j3 issued date : 2008.06.12 revised date: 2010.12.08 page:2/7 BTB772J3 cystek product specification characteristics (ta=25 c) symbol min. typ. max. unit test conditions bv cbo -40 - - v i c =-50 a, i e =0 bv ceo -30 - - v i c =-1ma, i b =0 bv ebo -6 - - v i e =-50 a, i c =0 i cbo - - -1 a v cb =-40v, i e =0 i ebo - - -1 a v eb =-6v, i c =0 *v ce(sat) - -0.45 -0.6 v i c =-2a, i b =-0.2a *v be(sat) - -1 -1.5 v i c =-2a, i b =-0.2a *h fe 1 120 - - - v ce =-2v, i c =-20ma *h fe 2 180 - 500 - v ce =-2v, i c =-500ma f t - 80 - mhz v ce =-5v, i e =-0.1a, f=100mhz cob - 55 - pf v cb =-10v, f=1mhz *pulse test : pulse width 380 s, duty cycle 2% classification of h fe 2 rank p e range 180~390 250~500 ordering information device package shipping marking to-252 BTB772J3 2500 pcs / tape & reel b772 (rohs compliant package) recommended storage condition: temperature : 10~ 35 c humidity : 30~ 60% rh recommended soldering footprint
cystech electronics corp. spec. no. : c809j3 issued date : 2008.06.12 revised date: 2010.12.08 page:3/7 BTB772J3 cystek product specification typical characteristics current gain vs collector current 10 100 1000 1 10 100 1000 10000 collector current---ic(ma) current gain---hfe vce=1v vce=2v vce=5v saturation voltage vs collector current 1 10 100 1000 10000 1 10 100 1000 10000 collector current---ic(ma) saturation voltage---(mv) vcesat@ic=50ib vcesat=10ib vcesat=20ib saturation voltage vs collector current 100 1000 10000 1 10 100 1000 10000 collector current---ic(ma) saturation voltage---(mv) vbesat@ic=10ib on voltage vs collector current 100 1000 10000 1 10 100 1000 10000 collector current---ic(ma) on voltage---(mv) vbeon@vce=2v power derating curve 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0 50 100 150 200 ambient temperature---ta() power dissipation---pd(w) power derating curve 0 2 4 6 8 10 12 0 50 100 150 200 case temperature---tc() power dissipation---pd(w)
cystech electronics corp. spec. no. : c809j3 issued date : 2008.06.12 revised date: 2010.12.08 page:4/7 BTB772J3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c809j3 issued date : 2008.06.12 revised date: 2010.12.08 page:5/7 BTB772J3 cystek product specification recommended wave soldering condition peak temperature soldering time product pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak 10-30 seconds 20-40 seconds temperature(tp) ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c809j3 issued date : 2008.06.12 revised date: 2010.12.08 page:6/7 BTB772J3 cystek product specification to-252ab dimension *: typical inches millimeters inches millimeters marking: style: pin 1.base 2.collector 3.emitter 4.collector 3-lead to-252ab plastic surface mount package cystek package code: j3 device name date code b772 4 hfe rank dim min. max. min. max. dim min. max. min. max. a 0.087 0.094 2.200 2.400 e *0.091 *2.300 a1 0.000 0.005 0.000 0.127 e1 0.177 0.185 4.500 4.700 b 0.053 0.065 1.350 1.650 h 0.118 ref 3.000 ref b 0.020 0.028 0.500 0.700 k 0.197 ref 5.000 ref b1 0.028 0.035 0.700 0.900 l 0.374 0.390 9.500 9.900 c 0.017 0.023 0.430 0.580 l1 0. 100 0.114 2.550 2.900 c1 0.017 0.023 0.430 0.580 l2 0.055 0.070 1.400 1.780 d 0.250 0.262 6.350 6.650 l3 0.024 0.035 0.600 0.900 d1 0.205 0.213 5.200 5.400 p 0.028 ref 0.700 ref e 0.213 0.224 5.400 5.700 v 0.209 ref 5.300 ref notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead : pure tin plated ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0
cystech electronics corp. spec. no. : c809j3 issued date : 2008.06.12 revised date: 2010.12.08 page:7/7 BTB772J3 cystek product specification to-252aa dimension inches millimeters inches marking: style: pin 1.base 2.collector 3.emitter 4.collector 3-lead to-252aa plastic surface mount package cystek package code: j3 device name date code b772 1 2 3 4 hfe rank millimeters dim min. max. min. max. dim min. max. min. max. a 0.087 0.094 2.200 2.400 e 0.086 0.094 2.186 2.386 a1 0.000 0.005 0.000 0.127 e1 0.172 0.188 4.372 4.772 b 0.039 0.048 0.990 1.210 h 0.163 ref 4.140 ref b 0.026 0.034 0.660 0.860 k 0.190 ref 4.830 ref b1 0.026 0.034 0.660 0.860 l 0.386 0.409 9.800 10.400 c 0.018 0.023 0.460 0.580 l1 0.114 ref 2.900 ref c1 0.018 0.023 0.460 0.580 l2 0.055 0.067 1.400 1.700 d 0.256 0.264 6.500 6.700 l3 0.024 0.039 0.600 1.000 d1 0.201 0.215 5.100 5.460 p 0.026 ref 0.650 ref e 0.236 0.244 6.000 6.200 v 0.211 ref 5.350 ref notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead : pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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